A Review of High-Heat-Flux Heat Removal Technologies

被引:274
作者
Ebadian, M. A. [1 ]
Lin, C. X. [2 ]
机构
[1] Florida Int Univ, Dept Mech & Mat Engn, Miami, FL 33199 USA
[2] Univ Tennessee, Dept Mech Aerosp & Biomed Engn, Knoxville, TN 37996 USA
来源
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 2011年 / 133卷 / 11期
关键词
high heat flux; extreme-high heat flxu; jet impingement; spray; microchannel; piezoelectric droplet; wettability; electronic cooling; thermal management; PRESSURE-DROP; JET IMPINGEMENT; THERMAL MANAGEMENT; ACCELERATOR TARGETS; 2-PHASE FLOW; SPRAY; DIAMETER; MICRO; PERFORMANCE; MICROCHANNELS;
D O I
10.1115/1.4004340
中图分类号
O414.1 [热力学];
学科分类号
摘要
In recent years, high-heat-flux cooling techniques have received great attention from researchers around the world due to its importance in thermal management of both commercial and defense high-power electronic devices. Although impressive progress has been made during the last few decades, high-heat-flux removal still largely remains as a challenging subject that needs further exploration and study. In this paper, we have reviewed recent developments in several high-heat-flux heat removal techniques, including microchannels, jet impingements, sprays, wettability effects, and piezoelectrically driven droplets. High-heat-flux removal can be achieved effectively by either single-phase flow or two-phase flow boiling heat transfer. Better understandings of the underlying heat transfer mechanisms for performance improvement are discussed. [DOI: 10.1115/1.4004340]
引用
收藏
页数:11
相关论文
共 103 条
[1]   State of the art of high heat flux cooling technologies [J].
Agostini, Bruno ;
Fabbri, Matteo ;
Park, Jung E. ;
Wojtan, Leszek ;
Thome, John R. ;
Michel, Bruno .
HEAT TRANSFER ENGINEERING, 2007, 28 (04) :258-281
[2]  
Alvarado J. L., 2010, 27 ARM SCI C
[3]   MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics [J].
Amon, CH ;
Murthy, J ;
Yao, SC ;
Narumanchi, S ;
Wu, CF ;
Hsieh, CC .
EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2001, 25 (05) :231-242
[4]   Significant Nusselt number increase in microchannels with a segmented flow of two immiscible liquids: An experimental study [J].
Asthana, Ashish ;
Zinovik, Igor ;
Weinmueller, Christian ;
Poulikakos, Dimos .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2011, 54 (7-8) :1456-1464
[5]   Digitized heat transfer: A new paradigm for thermal management of compact micro systems [J].
Baird, Eric ;
Mohseni, Kamran .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (01) :143-151
[6]   Flow boiling heat transfer of Freon R11 and HCFC123 in narrow passages [J].
Bao, ZY ;
Fletcher, DF ;
Haynes, BS .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2000, 43 (18) :3347-3358
[7]   Direct liquid cooling of high flux micro and nano electronic components [J].
Bar-Cohen, Avram ;
Arik, Mehmet ;
Ohadi, Michael .
PROCEEDINGS OF THE IEEE, 2006, 94 (08) :1549-1570
[8]  
Beltz A. R., 2011, P 2011 IEEE 24 INT C, P1191
[9]   Review and comparative analysis of studies on saturated flow boiling in small channels [J].
Bertsch, Stefan S. ;
Groll, Eckhard A. ;
Garimella, Suresh V. .
NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING, 2008, 12 (03) :187-227
[10]   Experimental investigation of non-uniform heating effect on flow boiling instabilities in a microchannel-based heat sink [J].
Bogojevic, D. ;
Sefiane, K. ;
Walton, A. J. ;
Lin, H. ;
Cummins, G. ;
Kenning, D. B. R. ;
Karayiannis, T. G. .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2011, 50 (03) :309-324