Cross comparison of direct strength testing techniques on polysilicon films

被引:16
作者
LaVan, DA [1 ]
Tsuchiya, T [1 ]
Coles, G [1 ]
Knauss, WG [1 ]
Chasiotis, I [1 ]
Read, D [1 ]
机构
[1] MIT, Cambridge, MA 02139 USA
来源
MECHANICAL PROPERTIES OF STRUCTURAL FILMS | 2001年 / 1413卷
关键词
polysilicon; MEMS; thin film; tensile; fracture; strength; testing; distribution;
D O I
10.1520/STP10977S
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Several direct and indirect testing techniques to characterize the strength and distribution in strength of structural thin films have been developed with widely varying results appearing in the literature (roughly 1 to 4 GPa for polysilicon). Much of the variation bem,een authors has been explained in terms of microstructural differences, sample size effects, and release techniques. Five laboratories participated in a cross comparison of direct tensile testing techniques in an effort to study these variations; all samples were fabricated and released simultaneously at Sandia National Labs to eliminate material variations. Sample lengths ranged from 15 to 1000 mum long. All the samples were fabricated with a thickness of 2.5 mum. The distributions in strength are reported along with a tabulation of mean, standard deviation, and Weibull modulus of fracture strength for each tab.
引用
收藏
页码:16 / 27
页数:12
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