Cross comparison of direct strength testing techniques on polysilicon films

被引：16

作者：

LaVan, DA ^{[1
]}

Tsuchiya, T ^{[1
]}

Coles, G ^{[1
]}

Knauss, WG ^{[1
]}

Chasiotis, I ^{[1
]}

Read, D ^{[1
]}

机构：

[1] MIT, Cambridge, MA 02139 USA

来源：

MECHANICAL PROPERTIES OF STRUCTURAL FILMS | 2001年 / 1413卷

关键词：

polysilicon; MEMS; thin film; tensile; fracture; strength; testing; distribution;

D O I：

10.1520/STP10977S

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Several direct and indirect testing techniques to characterize the strength and distribution in strength of structural thin films have been developed with widely varying results appearing in the literature (roughly 1 to 4 GPa for polysilicon). Much of the variation bem,een authors has been explained in terms of microstructural differences, sample size effects, and release techniques. Five laboratories participated in a cross comparison of direct tensile testing techniques in an effort to study these variations; all samples were fabricated and released simultaneously at Sandia National Labs to eliminate material variations. Sample lengths ranged from 15 to 1000 mum long. All the samples were fabricated with a thickness of 2.5 mum. The distributions in strength are reported along with a tabulation of mean, standard deviation, and Weibull modulus of fracture strength for each tab.

引用

页码：16 / 27

页数：12

共 17 条

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