Analysis of interfacial thermal stresses in a trimaterial assembly

被引：59

作者：

Suhir, E ^{[1
]}

机构：

[1] Lucent Technol Inc, Bell Labs, Phys Sci & Engn Res Div, Murray Hill, NJ 07974 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2001年 / 89卷 / 07期

关键词：

D O I：

10.1063/1.1350623

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The interfacial stresses in, and the curvature of, an elongated trimaterial assembly, subjected to the change in temperature, are predicted based on an approximate structural analysis (strength-of-materials) model. The obtained results can be helpful in stress-strain evaluations and physical design of trimaterial assemblies in microelectronic and photonic packaging. (C) 2001 American Institute of Physics.

引用

页码：3685 / 3694

页数：10