Activation energy and curing behavior of resol- and novolac-type phenolic resins by differential scanning calorimetry and thermogravimetric analysis

被引:93
作者
Lee, YK
Kim, DJ
Kim, HJ [1 ]
Hwang, TS
Rafailovich, M
Sokolov, J
机构
[1] Seoul Natl Univ, Sch Biol Resources & Mat Engn, Lab Adhes & Biocomposites, Suwon 441744, South Korea
[2] Chungnam Natl Univ, Dept Chem Engn, Taejon 30533, South Korea
[3] SUNY Stony Brook, Dept Mat Sci & Engn, Stony Brook, NY 11794 USA
关键词
differential scanning calorimetry (DSC); thermogravimetric analysis (TGA); curing of polymers; activation energy; resins;
D O I
10.1002/app.12340
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The thermal behavior, thermal degradation kinetics, and pyrolysis of resol and novolac phenolic resins with different curing conditions, as a function of the formaldehyde/phenol (F/P) molar ratio (1.3, 1.9, and 2.5 for the resol resins and 0.5, 0.7, and 0.9 for the novolac resins) were investigated. The activation energy of the thermal reaction was studied with differential scanning calorimetry at five different heating rates (2, 5, 10, 20, and 40degreesC/min) between 50 and 300degreesC. The activation energy of the thermal decomposition was investigated with thermogravimetric analysis at five different heating rates (2, 5, 10, 20, and 40degreesC/min) from 30 to 800degreesC. The low molar ratio resins exhibited a higher activation energy than the high molar ratio resins in the curing process. This meant that less heat was needed to cure the high molar ratio resins. Therefore, the higher the molar ratio was, the lower the activation energy was of the reaction. As the thermal decomposition of the resol resins proceeded, the activation energy sharply decreased at first and then remained almost constant. The activation energy of the thermal decomposition for novolac resins with F/P = 0.5 or F/P = 0.7 was almost identical in all regions, whereas that for novolac resins with F/P = 0.9 gradually decreased as the reaction proceeded. (C) 2003 Wiley Periodicals, Inc.
引用
收藏
页码:2589 / 2596
页数:8
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