Wear-contact problems and modeling of chemical mechanical polishing

被引：102

作者：

Chekina, OG ^{[1
]}

Keer, LM

Liang, H

机构：

[1] Northwestern Univ, Dept Civil Engn, Evanston, IL 60208 USA

[2] Cabot Corp, Microelect Mat Div, Aurora, IL 60504 USA

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1998年 / 145卷 / 06期

关键词：

D O I：

10.1149/1.1838603

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Wafer shape and contact pressure evolution during chemical mechanical polishing, and the characteristics of the steady-state regime are analyzed on the basis of approaches developed in contact mechanics. Nonplanarity caused by the geometrical nonuniformity (erosion) and by the presence of different material on the surface (recess) is considered. The possibility of the process optimization and the determination of system parameters based on the polished surface profiles is discussed.

引用

页码：2100 / 2106

页数：7

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