Experiments on anisotropic etching of Si in TMAH

被引:69
作者
You, JS
Kim, D
Huh, JY
Park, HJ
Pak, JJ
Kang, CS
机构
[1] Seoul Natl Univ, Sch Mat Sci & Engn, Kwanak Ku, Seoul 151742, South Korea
[2] Korea Univ, Dept Mat Sci & Engn, Seoul 136701, South Korea
[3] Korea Univ, Sch Elect Engn, Sungbuk Ku, Seoul 136701, South Korea
关键词
TMAH; anisotropic etching; reflectance; inverted pyramids; random pyramids;
D O I
10.1016/S0927-0248(00)00156-2
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Recently, TMAH has been widely studied due to its MOS compatibility, nontoxic, and good anisotropic etching characteristics. In this work, TMAH etching of Si was carried out at different temperatures (70 degreesC, 80 degreesC and 90 degreesC) and concentrations (5, 15 and 25 wt%). From a patterned Si wafer, inverted pyramids with smooth surface and sharp pyramid vertices were obtained. Uniform random pyramids were obtained from a bare Si wafer, and optimum reflectanceas low as 0.2% was obtained by near normal incident reflectivity measurement. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:37 / 44
页数:8
相关论文
共 7 条
[1]   Characterisation of pyramid formation arising from the TMAH etching of silicon [J].
Choi, WK ;
Thong, JTL ;
Luo, P ;
Tan, CM ;
Chua, TH ;
Bai, Y .
SENSORS AND ACTUATORS A-PHYSICAL, 1998, 71 (03) :238-243
[2]   TMAH/IPA ANISOTROPIC ETCHING CHARACTERISTICS [J].
MERLOS, A ;
ACERO, M ;
BAO, MH ;
BAUSELLS, J ;
ESTEVE, J .
SENSORS AND ACTUATORS A-PHYSICAL, 1993, 37-8 :737-743
[3]  
Naseh S, 1996, CAN J PHYS, V74, pS79, DOI 10.1139/p96-837
[4]  
RISTIC L, 1994, SENSOR TECHNOLOGY DE, P49
[5]   Anisotropic etching rates of single-crystal silicon for TMAH water solution as a function of crystallographic orientation [J].
Sato, K ;
Shikida, M ;
Yamashiro, T ;
Asaumi, K ;
Iriye, Y ;
Yamamoto, M .
SENSORS AND ACTUATORS A-PHYSICAL, 1999, 73 (1-2) :131-137
[6]   ANISOTROPIC ETCHING OF CRYSTALLINE SILICON IN ALKALINE-SOLUTIONS .1. ORIENTATION DEPENDENCE AND BEHAVIOR OF PASSIVATION LAYERS [J].
SEIDEL, H ;
CSEPREGI, L ;
HEUBERGER, A ;
BAUMGARTEL, H .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (11) :3612-3626
[7]   ANISOTROPIC ETCHING OF SILICON IN TMAH SOLUTIONS [J].
TABATA, O ;
ASAHI, R ;
FUNABASHI, H ;
SHIMAOKA, K ;
SUGIYAMA, S .
SENSORS AND ACTUATORS A-PHYSICAL, 1992, 34 (01) :51-57