Microscopic mechanisms of ablation and micromachining of dielectrics by using femtosecond lasers

被引：66

作者：

Jia, TQ

Xu, ZZ

Li, XX

Li, RX

Shuai, B

Zhao, FL

机构：

[1] Chinese Acad Sci, Shanghai Inst Opt & Fine Mech, Lab High Intens Opt, Shanghai 201800, Peoples R China

[2] Zhongshan Univ, State Key Lab Opt & Elect Mat & Technol, Guangzhou 510275, Peoples R China

来源：

APPLIED PHYSICS LETTERS | 2003年 / 82卷 / 24期

关键词：

D O I：

10.1063/1.1583857

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We report measurements of damage threshold and ablation depth for SiO2 and CaF2 irradiated under lasers at wavelengths of 800 and 400 nm for duration of 45-800 fs. These results can be well understood by using a developed avalanche model. The model includes the production of conduction band electrons (CBEs), laser energy deposition, and CBE diffusion. The evolution of microexplosion is investigated based on this model. (C) 2003 American Institute of Physics.

引用

收藏

页码：4382 / 4384

页数：3

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