The Mini Flex Ball-Grid-Array Chip-Scale Package

被引：2

作者：

Ang, S ^{[1
]}

Meyer, D ^{[1
]}

Thach, T ^{[1
]}

Schaper, L ^{[1
]}

Brown, WD ^{[1
]}

机构：

[1] Univ Arkansas, High Dens Elect Ctr, Fayetteville, AR 72701 USA

来源：

2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/EPTC.1998.755972

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The reliability of the Mini-Flex Ball Grid Array Chip Scale Package (mF-BGA CSP) was investigated. Thermal shock testing on these packages revealed that both the underfill and test board metallization play a significant role in reliability. A time-domain reflectometry method was used to detect which interface failure caused the mF-BGA CSP to fail. The predominant failure was determined to be at the solder ball/PCB interface.

引用

页码：13 / 17

页数：5