Fabrication of LIGA mold inserts

被引：48

作者：

Bacher, W ^{[1
]}

Bade, K ^{[1
]}

Matthis, B ^{[1
]}

Saumer, M ^{[1
]}

Schwarz, R ^{[1
]}

机构：

[1] Forschungszentrum Karlsruhe, Inst Mikrostrukturtech, D-76344 Eggenstein, Leopoldshafen, Germany

来源：

MICROSYSTEM TECHNOLOGIES | 1998年 / 4卷 / 03期

关键词：

Recrystallization; Surface Quality; Intermediate Layer; Good Surface; Temperature Application;

D O I：

10.1007/s005420050110

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The present paper describes the fabrication sequence of a LIGA mold insert by electroforming after the patterning steps of the overall process. These tools are applied for large scale fabrication of microcomponents made by molding and embossing processes. The application of an intermediate layer system leads to optimized process performance and to a better surface quality of the mold insert. The plating processes are described and the materials properties, e.g. hardness, are used for the characterization of the recrystallization behavior of the electroformed nickel which yields the high temperature application limit of the tool.

引用

页码：117 / 119

页数：3