The effect of melt temperature profile on the transient metal/mold heat transfer coefficient during solidification

被引:64
作者
Ferreira, IL
Spinelli, JE
Pires, JC
Garcia, A
机构
[1] Univ Estadual Campinas, UNICAMP, Dept Mat Engn, BR-13083970 Campinas, SP, Brazil
[2] Fed Ctr Technol Educ Minas Gerais, BR-36700000 Leopoldina, MG, Brazil
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2005年 / 408卷 / 1-2期
基金
巴西圣保罗研究基金会;
关键词
metal/mold heat transfer coefficient; solidification; numerical modeling;
D O I
10.1016/j.msea.2005.08.145
中图分类号
TB3 [工程材料学];
学科分类号
0805 [材料科学与工程]; 080502 [材料学];
摘要
Modeling of casting solidification can provide a method for improving casting yields. An accurate casting solidification model might be used to predict microstructure and to control the process based on thermal and operational parameters, and for this, it is necessary the previous knowledge of the transient metal/mold heat transfer coefficient, h(i). Most investigations concerning the overall heat transfer coefficient between metal and mold have applied numerical methods for the solution of the inverse heat conduction problem (IHCP). In general, such studies consider a constant initial melt temperature in order to reckon the time-dependent h(i). In the present work, solidification experiments have been carried with alloys of two metallic systems, and experimentally obtained temperatures were used by a numerical technique in order to determine transient metal/mold heat transfer coefficients, h(i). It is shown that h(i) profiles can be affected significantly by the initial melt temperature distribution. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:317 / 325
页数:9
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