Selective metal electrodeposition through doping modulation of semiconductor surfaces

被引:15
作者
Scheck, C
Evans, P
Schad, R
Zangari, G
Sorba, L
Biasiol, G
Heun, S
机构
[1] Univ Alabama, Dept Phys & Astron, Tuscaloosa, AL 35487 USA
[2] Univ Alabama, Ctr Mat Informat Technol, Tuscaloosa, AL 35487 USA
[3] Univ Virginia, Dept Mat Sci & Engn, Charlottesville, VA 22904 USA
[4] Univ Virginia, Ctr Electrochem Sci & Engn, Charlottesville, VA 22904 USA
[5] Lab Nazl TASC INFM, Area Ric Trieste, I-34012 Trieste, Italy
[6] Univ Modena & Reggio Emilia, Dipartimento Fis, I-41100 Modena, Italy
[7] Sincrotrone Trieste, Elettra, I-34014 Trieste, Italy
基金
美国国家科学基金会;
关键词
D O I
10.1063/1.1896086
中图分类号
O59 [应用物理学];
学科分类号
摘要
We demonstrate selective electrodeposition of magnetic layers on doped semiconductors resulting in a self-aligned pattern which replicates the doping pattern in the semiconductor surface. A Schottky barrier forms at the interface between a semiconductor substrate and the electrolyte, which upon application of a cathodic potential is biased in the forward (reverse) direction for n- or p-type semiconductors, respectively. Electron transfer from an n-type semiconductor is thus possible, while breakdown of the Schottky barrier would be necessary for deposition on a p-type substrate. The process will thus be spatially selective on a lateral modulation of the substrate doping. As an example we demonstrate the deposition of Co on GaAs. (C) 2005 American Institute of Physics.
引用
收藏
页码:1 / 3
页数:3
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