Surface treatment of copper for the adhesion improvement to epoxy mold compounds

被引：21

作者：

Cui, CQ ^{[1
]}

Tay, HL ^{[1
]}

Chai, TC ^{[1
]}

Gopalakrishnan, R ^{[1
]}

Lim, TB ^{[1
]}

机构：

[1] Inst Microelect, Singapore 117685, Singapore

来源：

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ECTC.1998.678863

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

This paper is related to surface treatment of copper leadframe to improve the adhesion of copper to mold compounds and die attach adhesives in IC packages. The surface treatment includes the initial roughening of Cu surface by Cu electrodeposition and electroless Cu placing, followed by an electrolytic chemical treatment in a chemical solution. The adhesion of treated Cu to mold compound and die attach adhesive, after surface treatment, is proven to be considerably increased. The oxygen-deficit silicon oxide is detected by XPS, Auger and FTIR to have formed on the treated Cu surface by the chemical treatment, thereby increasing adhesion by forming the chemical bonding between Cu and epoxy adhesive. The surface roughening of Cu is important in maintaining the high adhesion of Cu after temperature/humidity exposure by providing a mechanical inter-lock structure which impedes or prevents the ingress of moisture into the interface. The integration of surface roughening and chemical treatment of Cu leadframe significantly increases the adhesion of Cu to epoxy compounds even after thermal simulation and temperature/humidity exposure. As a result, TQFP packages with treated leadframes passed the IPC level 1 moisture sensitivity rest.

引用

页码：1162 / 1166

页数：5