Comparison of the submicron particle analysis capabilities of Auger electron spectroscopy, time-of-flight secondary ion mass spectrometry, and scanning electron microscopy with energy dispersive x-ray spectroscopy for particles deposited on silicon wafers with 1 μm thick oxide layers

Future particle analysis methods must be capable of determining the composition of 100 nm and smaller particles. Determination of the oxidation state is a part of this capability. In this study, we compare Auger; scanning electron microscopy equipped with energy dispersive x-ray spectroscopy, and time-of-flight secondary ion mass spectrometry using a sized set of Al, Al2O3, and TiO2 deposited on silicon wafers having 1 mu m of thermally grown oxide. (C) 1998 American Vacuum Society.