Stress evolution during growth of sputtered Ni/Cu multilayers

被引：6

作者：

Ramaswamy, V ^{[1
]}

Clemens, BM ^{[1
]}

Nix, WD ^{[1
]}

机构：

[1] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA

来源：

MECHANISMS AND PRINCIPLES OF EPITAXIAL GROWTH IN METALLIC SYSTEMS | 1998年 / 528卷

关键词：

D O I：

10.1557/PROC-528-161

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Results from in-situ measurements of stress during growth of (111)-textured Ni/Cu multilayers with small and large bilayer periods are presented. In multilayers with small bilayer periods, Ni is in uniform tension and Cu in uniform compression. This behavior is modeled as the growth of a coherent multilayer with alloying in the layers. In multilayers with large bilayer periods, stress relaxation is observed but the measured stresses are much lower than expected based on a Mathews-Blakeslee relaxation process. An alternative stress relaxation mechanism based on high defect densities is presented and discussed.

引用

页码：161 / 168

页数：8