Electroless techniques for EMI shieldings

This paper discusses the progress made in the electroless plating techniques for fabrication of EMI shieldings. Although, there are alter active techniques such as zinc are spray, Cu or Ni conductive paints and RF/magnetron sputtering for deposition of conductive coatings on plastics, electroless techniques have advantage of better uniformity and adhesivity of coatings as well as higher shielding effectiveness. However, these techniques have disadvantages in respect of limited bath life and hazardous chemicals. It is suggested that if these problems are addressed jointly by academicians, industry and suppliers, these techniques can be widely used for the manufacture of EMI shieldings.