Microfabricated shear stress sensors, Part 2: Testing and calibration

被引:15
作者
Hyman, D [1 ]
Pan, T
Reshotko, E
Mehregany, M
机构
[1] Case Western Reserve Univ, Dept Elect Engn & Comp Sci, Cleveland, OH 44106 USA
[2] Case Western Reserve Univ, Dept Elect Engn & Appl Phys, Cleveland, OH 44106 USA
[3] Case Western Reserve Univ, Dept Aerosp & Mech Engn, Cleveland, OH 44106 USA
关键词
D O I
10.2514/2.666
中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
Three designs of surface-micromachined shear stress sensors have been tested and calibrated in a continuum how channel, The first design, for moderate shear stress conditions, is composed of passive sensors with optically determined sensitivities of 9 and 5.5 Pa/mu m of Boating-element deflection for two variants. The second-generation design features Boating elements integrated with on-chip electronics. The deflection is thus measured with a voltage output that displays significant nonlinearities due to the limitations of drive electronics. Complete calibration of the third design was performed, as these sensors were integrated with complex active element control circuitry. These devices demonstrated a device sensitivity of 1.02 V/Pa +/- 5% over a sensor range of 0.5-3.7 V.
引用
收藏
页码:73 / 78
页数:6
相关论文
共 19 条
[1]  
*AB DEV, 1994, DAT SHEET ADXL50 MON
[2]  
ALLEY RL, 1992, IEEE SOL STAT SENS A, P202
[3]  
CORE TA, 1993, SOLID STATE TECHNOL, V26, P39
[4]  
HAKKINEN RJ, 1991, 17 ANN MIN AER SCI T
[5]  
HYMAN D, 1996, THESIS CASE W RESERV
[6]  
LEGTENBERG R, 1993, 7TH P INT C SOL STAT, P198
[7]  
Mastrangelo C. H., 1993, Journal of Microelectromechanical Systems, V2, P33, DOI 10.1109/84.232593
[8]  
MEHREGANY M, 1993, INTRO MICROELECTROME
[9]  
MULHERN GT, 1993, 7 INT C SOL STAT SEN, P296
[10]   Microfabricated shear stress sensors, Part 1: Design and fabrication [J].
Pan, T ;
Hyman, D ;
Mehregany, M ;
Reshotko, E ;
Garverick, S .
AIAA JOURNAL, 1999, 37 (01) :66-72