Formation of intermetallic compounds in SnPbAg, SnAg, and SnAgCu solders on Ni/Au metallization

被引：27

作者：

Lee, KY ^{[1
]}

Li, M ^{[1
]}

机构：

[1] Inst Mat Res & Engn, Singapore 117602, Singapore

来源：

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2001年 / 32卷 / 10期

关键词：

D O I：

10.1007/s11661-001-0058-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Different intermetallic compounds, continuous or noncontinuous, were formed at the interface for SnPbAg, SnAg, and SnAgCu solders on Ni/Au metallization. A small amount of Au weakened solder joint strength drastically in the SnPbAg system after annealing at 150°C because of the formation of a two-layer structure. The two Pb-free system did not exhibit strength degradation. Thus, the detrimental effect of a small content of Au on solder joint strength did not occur in SnAg and SnAgCu systems.

引用

页码：2666 / 2668

页数：3

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