Meeting the process challenges for spin-valve fabrication on an industrial scale

被引:1
作者
Schwartz, PV [1 ]
Bubber, R [1 ]
Paranjpe, AP [1 ]
Kools, JCS [1 ]
机构
[1] CVC, Fremont, CA 94538 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1998年 / 16卷 / 05期
关键词
D O I
10.1116/1.581462
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We investigated industrial deposition processes for spin-valve giant magneto resistance (GMR) multilayers. We compared rf diode with magnetron deposited films, as well as films deposited in a cluster tool equipped with single target process modules and a multitarget module. It is found that the best MR response is obtained by using de magnetron deposition in a multitarget process module, as this minimizes contamination by background gas atoms and interface mixing due to self-biasing of the substrate. Furthermore, de magnetron deposition allows accurate control of the deposition lime, and thus the thickness of 10-100 Angstrom films. Applying this method to spin-valve deposition results in a controllability of 0.5 Angstrom, a uniformity around 1% (= 1 sigma) over 150 mm wafers and repeatability around 1%. This implies that this process meets the requirements for production of GMR magnetic read heads. (C) 1998 American Vacuum Society. [S0734-2101(98)01604-2].
引用
收藏
页码:3080 / 3083
页数:4
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