Printed circuit board inspection using image analysis

被引：83

作者：

Loh, HH ^{[1
]}

Lu, MS ^{[1
]}

机构：

[1] Natl Yunlin Univ Sci & Technol, Dept Elect Engn, Touliu 640, Taiwan

来源：

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS | 1999年 / 35卷 / 02期

关键词：

inspection; printed circuit board; solder joint; structured light; surface mount technology;

D O I：

10.1109/28.753638

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

Computer vision has been widely used in on-line inspection of electronic components. In this paper, we present a computer vision system using structured lighting, which provides us with an efficient solution for solder joint inspection. Our system uses a novel structured-lighting inspection technology to overcome some difficulties that traditional computer vision systems often experience, We developed a slant map surface shape estimation technique for the solder joint. From this technique, a solder joint can be determined to lie a good (concave), bad (convex), bridged solder joint, or solder joint with surplus solder, or lacking solder.

引用

页码：426 / 432

页数：7

共 5 条

[1]

A TIERED-COLOR ILLUMINATION APPROACH FOR MACHINE INSPECTION OF SOLDER JOINTS [J].

CAPSON, DW ;

ENG, SK .

IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE, 1988, 10 (03) :387-393

[2]

NAKAGAWA Y, 1982, P SOC PHOTO-OPT INST, V336, P121, DOI 10.1117/12.933619

[3]

STRUCTURED HIGHLIGHT INSPECTION OF SPECULAR SURFACES [J].

SANDERSON, AC ;

WEISS, LE ;

NAYAR, SK .

IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE, 1988, 10 (01) :44-55

[4]

[No title captured]

[5]

[No title captured]

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