Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

被引：24

作者：

Blom, MT

Chmela, E

Gardeniers, JGE

Berenschot, JW

Elwenspoek, M

Tijssen, R

van den Berg, A

机构：

[1] Univ Twente, MESA Res Inst, NL-7500 AE Enschede, Netherlands

[2] Univ Amsterdam, Dept Chem Engn, NL-1018 WV Amsterdam, Netherlands

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2001年 / 11卷 / 04期

关键词：

D O I：

10.1088/0960-1317/11/4/317

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 degreesC and 1.5 kV results in a high-quality bond.

引用

页码：382 / 385

页数：4

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