TMA, DMA, DSC, and TGA of lead free solders

被引：9

作者：

Lau, JH ^{[1
]}

Chang, C ^{[1
]}

机构：

[1] Express Packaging Syst Inc, Palo Alto, CA 94303 USA

来源：

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ECTC.1998.678918

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Most of the electronics packaging materials, especially solders are temperature dependent. Their temperature-dependent material properties can be obtained by TMA (thermal mechanical analysis), DMA (dynamic mechanical analysis), DSC (differential scanning calorimeter), and TGA (thermogravimetric analysis). In this study, the thermal coefficient of expansion (TCE), storage modulus, moisture uptake, and melting point of two lead free solders, 96.5wt%Sn-3.5wt%Ag and 42wt%Sn-58wt%Bi provided from two different vendors, are measured by, respectively, TMA, DMA, TGA, and DSC. For comparison purpose, the 63wt%Sn-37wt%Pb solder is also considered.

引用

页码：1339 / 1344

页数：6