Fabrication of a miniature thermoelectric module with elements composed of sintered Bi-Te compounds

被引：14

作者：

Kishi, M ^{[1
]}

Yoshida, Y ^{[1
]}

Okano, H ^{[1
]}

Nemoto, H ^{[1
]}

Funanami, Y ^{[1
]}

Yamamoto, M ^{[1
]}

Kanazawa, H ^{[1
]}

机构：

[1] Seiko Instruments Inc, Matsudo, Chiba 271, Japan

来源：

PROCEEDINGS ICT'97 - XVI INTERNATIONAL CONFERENCE ON THERMOELECTRICS | 1997年

关键词：

D O I：

10.1109/ICT.1997.667614

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

A new manufacturing process of pi-shaped miniature thermoelectric module composed of sintered Bi-Te compounds has been developed. The manufacturing process is suitable for mass production as it is comprised of simple technologies such as conventional photolithography technology, micro-bonding technology using the solder bump method and precise cutting technology using a dicing machine. A miniature module with the dimensions of 3 mm X 3 mm X 1.3 mm in which 102 elements (51 junctions) with the dimensions of 120 mu m X 120 mu m incross section parallel to the substrates and a height of 600 mu m were included was fabricated while developing the process. The maximum temperature difference Delta Tmax, and the heat absorption Q(max) of the module were 61.3 degrees C and 0.36W, respectively. This indicates that the performance of the module asa cooling device was equivalent to that of conventional modules. The specification for high voltage and low current input, a significant purpose in addition to the miniaturization of the module, was achieved because the maximum voltage V-max and current I-max were 6.7 V and 110 mA, respectively.

引用

页码：653 / 656

页数：4