Thermal analysis of power LED employing dual interface method and water flow as a cooling system

被引：33

作者：

Anithambigai, P. ^{[1
]}

Dinash, K. ^{[1
]}

Mutharasu, D. ^{[1
]}

Shanmugan, S. ^{[1
]}

Lim, Choon Kim ^{[2
]}

机构：

[1] Univ Sains Malaysia, Sch Phys, Nano Optoelect Lab, Minden 11800, Penang, Malaysia

[2] Globetron Sdn Bhd, Res & Dev Lab, George Town 11900, Malaysia

来源：

THERMOCHIMICA ACTA | 2011年 / 523卷 / 1-2期

关键词：

Junction to board thermal resistance; Junction to ambient thermal resistance; Dual interface method; Water flow system; Optical performance;

D O I：

10.1016/j.tca.2011.06.001

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Thermal transient measurement based on structure function evaluation was used to measure the thermal resistance. The study signifies the importance of dual interface method in determining the exact point of separation between the board and the LED package. For a constant ambient temperature which was maintained at 28.2 +/- 1.0 degrees C at 700 mA, the junction to board thermal resistance obtained was 10.84 K/W. In addition, an experimental set up has been reported in this work having a constant water flow beneath the external heat sink. More emphasis has been given in studying the effect of change of such measurement environment on the junction to board thermal resistance. It was revealed that the junction to board thermal resistance was not affected but the total real thermal resistance from junction to ambient was reduced significantly by 55.6% upon cooling with water. A study on the effect of light output on the total thermal resistance was performed and it was revealed that the efficiency and the reliability of an LED are strongly dependent on the optical properties of the device. (C) 2011 Elsevier B.V. All rights reserved.

引用

页码：237 / 244

页数：8

共 22 条

[1] Temperature Dependent Thermal Resistance in Power LED Assemblies and a Way to Cope with It [J].

Andras Poppe ;

Gabor Molnar ;

Tamas Temesvoelgyi .

26TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2010, 2010, :283-288

[2]

[Anonymous], 511 EIAJEDEC

[3] The performance of compact thermal models for LED package [J].

Chen, Huanting ;

Lu, Yijun ;

Gao, Yulin ;

Zhang, Haibing ;

Chen, Zhong .

THERMOCHIMICA ACTA, 2009, 488 (1-2) :33-38

[4] Thermal analysis and optimization of multiple LED packaging based on a general analytical solution [J].

Cheng, Ting ;

Luo, Xiaobing ;

Huang, Suyi ;

Liu, Sheng .

INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2010, 49 (01) :196-201

[5] Thermal effects in packaging high power light emitting diode arrays [J].

Christensen, Adam ;

Graham, Samuel .

APPLIED THERMAL ENGINEERING, 2009, 29 (2-3) :364-371

[6] Kinetic model for degradation of light-emitting diodes [J].

Chuang, SL ;

Ishibashi, A ;

Kijima, S ;

Nakayama, N ;

Ukita, M ;

Taniguchi, S .

IEEE JOURNAL OF QUANTUM ELECTRONICS, 1997, 33 (06) :970-979

[7] Electric and thermal transient effects in high power optical devices [J].

Farkas, G ;

Haque, S ;

Wall, F ;

Martin, PS ;

Poppe, A ;

Vader, QVV ;

Bognár, G .

TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004, 2004, :168-176

[8] Omni-directional reflectors for light-emitting diodes [J].

Kim, Jong Kyu ;

Xi, J. -Q. ;

Schubert, E. Fred .

LIGHT-EMITING DIODES: RESEARCH, MANUFACTURING, AND APPLICATIONS X, 2006, 6134

[9] Thermal analysis of LED array system with heat pipe [J].

Kim, Lan ;

Choi, Jong Hwa ;

Jang, Sun Ho ;

Shin, Moo Whan .

THERMOCHIMICA ACTA, 2007, 455 (1-2) :21-25

[10] Multi-domain simulation and measurement of power LEDs and power LED assemblies [J].

Poppe, Andras ;

Farkas, Gabor ;

Szekely, Vladimir ;

Horvath, Gyoergy ;

Rencz, Marta .

TWENTY SECOND ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2006, 2006, :191-+

← 1 2 3 →