Characterization of silicon carbide and commercial-off-the-shelf (COTS) components for high-g launch and EM applications

被引:6
作者
Katulka, GL [1 ]
Hepner, DJ
Davis, B
Irwin, E
Ridgley, M
Kornegay, K
机构
[1] USA, Res Lab, Weapons & Mat Res Directorate, AMSRL,WM,BA, Aberdeen Proving Ground, MD 21005 USA
[2] Cornell Univ, Sch Elect Engn, Ithaca, NY 14853 USA
关键词
electric weapons; electromagnetics; EM; high-g; munitions; SiC; silicon carbide; widebandgap materials;
D O I
10.1109/20.911831
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recent experiments with die-level silicon carbide (SiC) transistors are described where the objective of the experiments is to determine the behavior of SLC held effect transistors (FET) in a high-g environment typical of conventional guns, missiles, or electric launchers. The results of the experiments hare shown for the first time that die-level SiC FET's can survive mechanical forces to as much as 12 000 times the force of gravity (12000-g's) without the mechanical support and protection of microelectronic encapsulation materials (e,g, plastic encapsulation material or PEM). A second series of experiments is performed with commercial-off-the-shelf (COTS) sensors that rely upon standard sensor technology including silicon (Si) semiconductors. These experiments provide details of several COTS sensors previously qualified for high-g environments, which are characterized here under harsh electromagnetic interference (EMI) conditions, The sensors tested include a Si optical solar cell, an accelerometer, and a magnetometer, The output response of the sensors is recorded during the EMI event to ascertain the effect of coupled electromagnetic radiation on the sensors.
引用
收藏
页码:248 / 251
页数:4
相关论文
共 10 条
[1]  
COOPER JA, 1997, MAT SCI ENG
[2]  
DAMICO WP, 1996, ARLTR1206 US ARM RES
[3]  
DAVIS BS, 1998, ARLMR417 APG MD US A
[4]  
GARNER JM, 1993, ARLTN23 ARM RES LAB
[5]  
HEPNER D, 2000, 46 INSTR SOC AM MAY
[6]  
KATULKA GL, 1999, APPL PHYS LETT, V74
[7]  
KATULKA GL, 1999, IEEE T MAGN, V35
[8]  
Lam MP, 1999, IEEE T ELECTRON DEV, V46, P546, DOI 10.1109/16.748875
[9]  
MULLER P, 1999, INT TEL C NOV
[10]  
NEUDECK PG, 1995, J ELECT MAT, V24