Materials for thermal conduction

被引：371

作者：

Chung, DDL ^{[1
]}

机构：

[1] SUNY Buffalo, Composite Mat Res Lab, Buffalo, NY 14260 USA

来源：

APPLIED THERMAL ENGINEERING | 2001年 / 21卷 / 16期

关键词：

thermal conduction; thermal conductivity; thermal paste; thermal contact; composite; interface;

D O I：

10.1016/S1359-4311(01)00042-4

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Materials for thermal conduction are reviewed. They include materials exhibiting high thermal conductivity (such as metals, carbons.. ceramics and composites), and thermal interface materials (such as polymer-based and silicate-based pastes and solder). (C) 2001 Elsevier Science Ltd. All rights reserved.

引用

页码：1593 / 1605

页数：13

共 77 条

[1] TEMPERATURE-DEPENDENCE OF THERMAL-EXPANSION OF CERAMICS AND METALS FOR ELECTRONIC PACKAGES [J].

CHANCHANI, R ;

HALL, PM .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (04) :743-750

[2] IMPROVEMENT OF THE TEMPERATURE RESISTANCE OF ALUMINUM-MATRIX COMPOSITES USING AN ACID PHOSPHATE BINDER .1. BINDERS [J].

CHIOU, JM ;

CHUNG, DDL .

JOURNAL OF MATERIALS SCIENCE, 1993, 28 (06) :1435-1446

[3] IMPROVEMENT OF THE TEMPERATURE RESISTANCE OF ALUMINUM-MATRIX COMPOSITES USING AN ACID PHOSPHATE BINDER .3. ALUMINUM-MATRIX COMPOSITES [J].

CHIOU, JM ;

CHUNG, DDL .

JOURNAL OF MATERIALS SCIENCE, 1993, 28 (06) :1471-1487

[4] IMPROVEMENT OF THE TEMPERATURE RESISTANCE OF ALUMINUM-MATRIX COMPOSITES USING AN ACID PHOSPHATE BINDER .2. PREFORMS [J].

CHIOU, JM ;

CHUNG, DDL .

JOURNAL OF MATERIALS SCIENCE, 1993, 28 (06) :1447-1470

[5] Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications [J].

Datta, SK ;

Tewari, SN ;

Gatica, JE ;

Shih, W ;

Bentsen, L .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1999, 30 (01) :175-181

[6]

DAVIDSON HL, 1995, ELEC COMP C, P538, DOI 10.1109/ECTC.1995.515335

[7]

Fleming T. F., 1995, Proceedings of the 1995 International Electronics Packaging Conference, P493

[8]

FLEMING TF, 1993, P SOC PHOTO-OPT INS, V1997, P136, DOI 10.1117/12.163796

[9]

FOSTER DA, 1989, 34 INT SAMPE S EXH S, P1401

[10]

Geiger A. L., 1989, ADV MAT P, V136, P6

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