Fabrication and characterization of a micro turbine/bearing rig

被引:17
作者
Lin, CC [1 ]
Ghodssi, R [1 ]
Ayon, AA [1 ]
Chen, DZ [1 ]
Jacobson, S [1 ]
Breuer, K [1 ]
Epstein, AH [1 ]
Schmidt, MA [1 ]
机构
[1] MIT, Microsyst Technol Labs, Cambridge, MA 02139 USA
来源
MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 1999年
关键词
D O I
10.1109/MEMSYS.1999.746884
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
This paper reports on a process to build, package, and instrument a 5-level wafer-bonded micro-machined turbine/bearing rig. The process flow involves the use of 5 wafers, 16 masks, and 9 deep silicon etching steps, as well as utilizing aligned wafer bonding, double-sided deep reactive ion etching (DRIE), and Laser-Assisted-Etching (LAE). This paper also shows experimental results on flow characteristics of the hydrostatic thrust bearings and the preliminary rotational performance of the device.
引用
收藏
页码:529 / 533
页数:5
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