Flexible polyimide interposer for CSP preparation

被引：2

作者：

Beyer, V ^{[1
]}

Kuchenmeister, F ^{[1
]}

Bottcher, M ^{[1
]}

Meusel, E ^{[1
]}

机构：

[1] Dresden Univ Technol, Semicond Technol & Microsyst Lab, D-01062 Dresden, Germany

来源：

3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ADHES.1998.742012

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Chip Size Packaging (CSP) is a promising approach in packaging and interconnect technologies in order to solve the increasing demands in microelectronics and microsystems [1-3]. The application of bare dies to produce electrical components is considered as the major advantage of this packaging concept. In this study, an interposer consisting of a polyimide film is attached by a pre-deposited adhesive at the active side of the chip. Photolithography for patterning the conductor lines in a semiadditive processing sequence was employed. Bond wire technique were used to connect the bond pads at the interposer and the die. The detailed description of the technology will focus on the adhesives deposition, the fabrication of the conductor pattern and the attachment of the pre-fabricated assembly to the board by soldering technique.

引用

页码：112 / 115

页数：4