Stress-corrosion cracking of spin-on glass thin films

被引：7

作者：

Cook, RF ^{[1
]}

Liniger, EG ^{[1
]}

机构：

[1] IBM Corp, Res, Yorktown Heights, NY 10598 USA

来源：

LOW-DIELECTRIC CONSTANT MATERIALS IV | 1998年 / 511卷

关键词：

D O I：

10.1557/PROC-511-171

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The crack-velocity behavior of silsesqioxane spin-on glass thin films exposed to moist environments is examined. An absolute reaction-rate model is used to predict crack velocity using a deleted-bond model and fused silica as a basis, and compared with observed steady-state crack velocities as a function of film thickness and variations in the curing process. An implication is that, on curing, the driving force for film fracture, determined by thermal expansion mismatch, increases less rapidly than the fracture resistance, determined by polymerization.

引用

页码：171 / 176

页数：6