Dynamic lateral force measurements during chemical mechanical polishing of silica

被引：46

作者：

Mahajan, U ^{[1
]}

Bielmann, M ^{[1
]}

Singh, RK ^{[1
]}

机构：

[1] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 1999年 / 2卷 / 02期

关键词：

D O I：

10.1149/1.1390741

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Lateral frictional force measurement provides an understanding of pad-surface interactions in chemical mechanical polishing. The lateral forces have been found to be significantly dependent on the surface roughness of the silica, thus showing that in situ dynamic changes in the surface roughness could be observed. Studies of the effect of pH and ionic strength on polishing characteristics of silica are presented. The studies were conducted with particle- free slurries, so as to obtain a better signal- to- noise ratio. The rate of material removal as a function of pH and ionic strength was determined and correlated with the friction force measurements. (C) 1999 The Electrochemical Society. S1099- 0062( 98) 07- 012- 6. All rights reserved.

引用

页码：80 / 82

页数：3

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