Low temperature full wafer adhesive bonding of structured wafers

被引：71

作者：

Niklaus, F ^{[1
]}

Andersson, H ^{[1
]}

Enoksson, P ^{[1
]}

Stemme, G ^{[1
]}

机构：

[1] Royal Inst Technol, KTH, Dept Signals Sensors & Syst, SE-10044 Stockholm, Sweden

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2001年 / 92卷 / 1-3期

关键词：

bonding; adhesive bonding; wafer bonding; polymer bonding; surface structures; BCB;

D O I：

10.1016/S0924-4247(01)00568-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we present a technology for void free low temperature full wafer adhesive bonding of structured wafers. Benzocyclobutene (BCB) is used as the intermediate bonding material. BCB bonds well with various materials and does not release significant amounts of byproducts during the curing process. Thus void-free bond interfaces can be achieved. Cured BCB coatings have an excellent resistance to a variety of acids, alkalines and solvents and a high transparency for light across the visible spectrum, which makes it a good material for fluidic, optical and packaging applications. We demonstrate the fabrication of fluidic structures and the embedding of protruding surface structures. An important finding is that the pre-cured BCB coatings are extremely deformable and have a "liquid-like" behaviour during bonding. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：235 / 241

页数：7

共 5 条

[1] Micromachined flow-through filter-chamber for chemical reactions on beads [J].

Andersson, H ;

van der Wijngaart, W ;

Enoksson, P ;

Stemme, G .

SENSORS AND ACTUATORS B-CHEMICAL, 2000, 67 (1-2) :203-208

[2]

ANDERSSON H, 2000, SENSOR ACTUAT B-CHEM, V3638, P1

[3]

*DOW CHEM COMP, 1997, DAT PROC PROC DRY ET

[4]

Niklaus F., 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308), P247, DOI 10.1109/MEMSYS.2000.838524

[5]

SPIER RE, 1995, SCI ENG ETHICS, V1, P151

← 1 →