Design for millimeter-wave applications in silicon technologies (Session invited)

被引:19
作者
Cathelin, Andreia [1 ]
Martineau, B. [1 ,2 ]
Seller, N. [1 ,3 ]
Douyere, S. [1 ]
Gorisse, J. [1 ,2 ]
Pruvost, S. [1 ]
Raynaud, Ch. [1 ,4 ]
Gianesello, F. [1 ]
Montusclat, S. [1 ]
Voinigescu, S. P. [5 ]
Niknejad, A. M. [6 ]
Belot, D. [1 ]
Schoellkopf, J. P. [1 ]
机构
[1] FTM, STMicroelect, F-38926 Crolles, France
[2] IEMN, F-59662 Villeneuve, France
[3] IMS Lab, F-33405 Talence, France
[4] CEA LETI, F-38000 Grenoble, France
[5] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada
[6] Univ Calif Berkeley, BWRC, Berkeley, CA 94704 USA
来源
ESSCIRC 2007: PROCEEDINGS OF THE 33RD EUROPEAN SOLID-STATE CIRCUITS CONFERENCE | 2007年
关键词
D O I
10.1109/ESSCIRC.2007.4430343
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the potentialities of advanced BiCMOS and CMOS technologies for millimeter-wave applications. To begin, the target applications in these frequency bands are presented: from automotive cruise control radars to wireless links. Then, a large overview of the technological offer to address these applications is presented: SiGe BiCMOS, nanometer bulk and SOI CMOS technologies. This work focuses both on active and passive devices (BEOL) behavior to suit for design above 20GHz. The paper continues with a presentation of several solutions for integrated circuits on the presented topic: front-end receiver blocks, transmission blocks and frequency synthesis solutions. An overview of state of the art silicon circuits is given. As a conclusion, perspectives regarding future challenges in terms of system integration and applications are discussed.
引用
收藏
页码:464 / +
页数:3
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