A study of the factors affecting copper cementation of gold from ammoniacal thiosulphate solution

被引:79
作者
Guerra, E [1 ]
Dreisinger, DB [1 ]
机构
[1] Univ British Columbia, Dept Met & Mat Engn, Vancouver, BC V6T 1Z4, Canada
关键词
copper; gold; ammoniacal thiosulphate solution;
D O I
10.1016/S0304-386X(98)00061-9
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Thiosulphate leaching of gold is a proposed alternative to cyanide leaching for certain types of refractory gold ores. The most promising method for recovering gold from thiosulphate leach solutions is by copper cementation. This study focused on determining how the factors of pH/ammonia concentration, copper concentration, thiosulphate concentration, sulphite concentration, and temperature, commonly manipulated in thiosulphate leaching studies, affect gold cementation performance using copper. These factors were varied in artificial leach solutions according to the ranges typically found in the literature. Both powder cementation and rotating disk electrode cementation were used to study the kinetics of gold cementation. Overall, the cementation of gold by copper from ammoniacal thiosulphate solution was concluded to be under mass transfer control. Higher temperatures and pH/ammonia concentration were determined to positively affect the rate of gold cementation. Conversely, sulphite and copper in solution were established to negatively affect cementation performance. (C) 1999 Published by Elsevier Science B.V. All rights reserved.
引用
收藏
页码:155 / 172
页数:18
相关论文
共 13 条
[1]   RECOVERY OF GOLD FROM THIOUREA, THIOCYANATE, OR THIOSULFATE SOLUTIONS BY REDUCTION-PRECIPITATION WITH A STABILIZED FORM OF SODIUM-BOROHYDRIDE [J].
AWADALLA, FT ;
RITCEY, GM .
SEPARATION SCIENCE AND TECHNOLOGY, 1991, 26 (09) :1207-1228
[2]  
BEREZOWSKY RMG, 1979, 108 ANN M AIME NEW O
[3]  
FLETT DS, 1983, T I MIN METALL, P92
[4]  
HEMMATI M, 1989, EXTR MET 89 S I MIN
[5]  
HU J, 1988, P RAND INT GOLD C PE
[6]  
JIANG T, 1993, AIMM PUB, V5, P1141
[7]  
Kerley B.J., 1983, United States, Patent No. 4369061
[8]  
KERLEY B.J. JR, 1981, U.S. Pat, Patent No. [4, 269, 622, 4269622]
[9]  
LIDE DR, 1996, CRC HDB CHEM PHYSICS
[10]  
LULHAM J, 1991, Patent No. 11539