Low cost high volume laser modules using silicon optical bench technology

被引：17

作者：

Osenbach, JW ^{[1
]}

Dautartas, MF ^{[1
]}

Pitman, E ^{[1
]}

Nijander, C ^{[1
]}

Brady, M ^{[1
]}

Schlenker, RK ^{[1
]}

Butrie, T ^{[1
]}

Scrak, SP ^{[1
]}

Auker, BS ^{[1
]}

Kern, D ^{[1
]}

Salko, S ^{[1
]}

Rinaudo, D ^{[1
]}

Whitcraft, C ^{[1
]}

Dormer, JF ^{[1
]}

机构：

[1] Bell Labs Innovat, Lucent Technol, Breinigsville, PA 18031 USA

来源：

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ECTC.1998.678753

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

As the information age continues to expand, there is a considerable need for low cost/high volume, reliable optoelectronic modules. Because of the potential cost savings, silicon optical bench technology (SiOB) has emerged as one of the leading enabling technology candidates needed for the commercial realization of such modules. As a result, over the past three to five years, there has been a significant number of papers published on the use of SiOB for low cost optoelectronic modules. In this pager we report on the use of SiOB technology used in the production of low cost/high volume, reliable laser modules. The SiOB platform is designed for manufacturability, reduced parts count, reduced process steps, and ability to accept design changes to respond to a rapidly changing marketplace. For example, this SiOB technology has been used for at least four different laser designs/types without significant changes in the SiOB manufacturing, optical subassembly, or package assembly process. The SiOB technology is the first of its kind in that it integrates. i) silicon micromachining for the lens holder cavities and back face monitor turning minor; ii) Ti/Pt/Au for interconnect metalization and photodiode bonding, iii) aluminum for AlO bonding attachment of the lens, and iv) Au/Sn solder for laser attachment. The laser and photodiode are passively aligned using a visual alignment system and fiducials on the silicon. The lens is self-aligned to the silicon during the AlO bonding process. Because we use AlO bonding for lens attachment and solder bonding for laser and photodiode attachment, this optical subassembly (OSA) contains no organic materials. Following the discussion on the OSA assembly technology, we discuss the assembly technology used to produce low cost uncooled laser modules and the performance of these modules. As was the case for OSA assembly, no organic adhesives are used in the hermetic enclosure of the laser module assembly. Finally, we present the reliability data for the module. The reliability data indicate that the optical alignment of these modules is extremely stable. We observe essentially no change in optical coupling as a result of extended storage at 85C:, extended temperature cycling between -40C and +85C, or extended storage at 40C/95%RH. To our knowledge, this is the first high volume/low cost, highly reliable edge emitting laser module that extensively uses SiOB technology and design for manufacture principles.

引用

页码：581 / 587

页数：7