UV curing of photoinitiator-free systems containing bismaleimides and diacrylate resins: bulk and surface properties

被引：29

作者：

Bongiovanni, R ^{[1
]}

Sangermano, M ^{[1
]}

Malucelli, G ^{[1
]}

Priola, A ^{[1
]}

机构：

[1] Politecn Torino, Dipartimento Sci Mat & Ingn Chim, I-10129 Turin, Italy

来源：

PROGRESS IN ORGANIC COATINGS | 2005年 / 53卷 / 01期

关键词：

photoinitiator-free photopolymerization; bismaleimide; polysiloxane acrylates; bulk and surface properties;

D O I：

10.1016/j.porgcoat.2004.11.009

中图分类号：

O69 [应用化学];

学科分类号：

081704 ;

摘要：

UV curing of photoinitiator-free systems containing a bismaleimide and different diacrylates was investigated. Firstly we investigated the copolymerization of a bismaleimide and a polysiloxane diacrylate resin using different monomer ratios. Moreover, a typical diacrylate (bisphenolAdiglycydyletherdiacrylate) (BREDA) was employed and the bulk properties of the networks were modulated varying the amount of bismaleimide in the photocurable mixture. The curing process was monitored by FTIR and the thermal properties by DSC analyses. Surface properties were changed by addition of small amounts (less than 1 wt.%) of a polysiloxane diacrylate to the bismaleimide/BHEDA 50-50 mol% mixture: notwithstanding the low concentration of the siloxane monomer, highly hydrophobic surfaces were obtained. (c) 2005 Elsevier B.V. All rights reserved.

引用

页码：46 / 49

页数：4

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