Palladium thin film deposition on polyimide by CWAr+ laser radiation for electroless copper plating

被引：41

作者：

Kordás, K

Leppävuori, S

Uusimäki, A

George, TF ^{[1
]}

Nánai, L

Vajtai, R

Bali, K

Békési, J

机构：

[1] Infotech Oulu, Microelect & Mat Phys Labs, FIN-90570 Oulu, Finland

[2] Infotech Oulu, EMPART Res Grp, FIN-90570 Oulu, Finland

[3] Univ Wisconsin, Dept Chem, Off Chancellor, Stevens Point, WI 54481 USA

[4] Univ Wisconsin, Dept Phys & Astron, Off Chancellor, Stevens Point, WI 54481 USA

[5] Attila Jozsef Univ, Dept Expt Phys, H-6720 Szeged, Hungary

来源：

THIN SOLID FILMS | 2001年 / 384卷 / 02期

基金：

匈牙利科学研究基金会;

关键词：

laser irradiation; metallization; palladium; polymers;

D O I：

10.1016/S0040-6090(00)01829-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Ar+ laser radiation (CW, 488 nm) is used to induce deposition of palladium (Pd) thin films onto polyimide surfaces from palladium-amine {[Pd(NH3)(4)](2+)} solutions. The chemical reaction is carried out by formaldehyde-assisted reduction of palladium-amine complex molecules to metallic Pd, and is localized on the polymer substrate by a focused and scanned Arf laser beam. The narrow (6-14 mum), homogeneous and thin (< 50 nm) palladium patterns are found to be excellent catalysts for further copper autocatalytic electroless deposition. Both the Pd and Cu layers are characterized by scanning electron microscopy (equipped with EDAX), a DEKTAK profiler and resistivity measurements. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：185 / 188

页数：4

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