Dynamic microscopy of nanoscale cluster growth at the solid-liquid interface

被引:617
作者
Williamson, MJ
Tromp, RM
Vereecken, PM
Hull, R
Ross, FM [1 ]
机构
[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
[2] Univ Virginia, Sch Engn & Appl Sci, Charlottesville, VA 22903 USA
关键词
D O I
10.1038/nmat944
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Dynamic processes at the solid–liquid interface are of key importance across broad areas of science and technology. Electrochemical deposition of copper, for example, is used for metallization in integrated circuits, and a detailed understanding of nucleation, growth and coalescence is essential in optimizing the final microstructure. Our understanding of processes at the solid–vapour interface has advanced tremendously over the past decade due to the routine availability of real-time, high-resolution imaging techniques yielding data that can be compared quantitatively with theory1,2,3. However, the difficulty of studying the solid–liquid interface leaves our understanding of processes there less complete. Here we analyse dynamic observations—recorded in situ using a novel transmission electron microscopy technique—of the nucleation and growth of nanoscale copper clusters during electrodeposition. We follow in real time the evolution of individual clusters, and compare their development with simulations incorporating the basic physics of electrodeposition during the early stages of growth. The experimental technique developed here is applicable to a broad range of dynamic phenomena at the solid–liquid interface.
引用
收藏
页码:532 / 536
页数:5
相关论文
共 30 条
[1]   INTRODUCTORY LECTURE STUDIES OF THE LIQUID-SOLID INTERFACE BY SCANNING-TUNNELING-MICROSCOPY AND SCANNING ELECTROCHEMICAL MICROSCOPY [J].
BARD, AJ ;
FAN, FR .
FARADAY DISCUSSIONS, 1992, 94 :1-22
[2]  
Budevski E., 1996, ELECTROCHEMICAL PHAS
[3]   THE GROWTH OF CRYSTALS AND THE EQUILIBRIUM STRUCTURE OF THEIR SURFACES [J].
BURTON, WK ;
CABRERA, N ;
FRANK, FC .
PHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1951, 243 (866) :299-358
[4]   Surface atomic structure of KDP crystals in aqueous solution: An explanation of the growth shape [J].
de Vries, SA ;
Goedtkindt, P ;
Bennett, SL ;
Huisman, WJ ;
Zwanenburg, MJ ;
Smilgies, DM ;
De Yoreo, JJ ;
van Enckevort, WJP ;
Bennema, P ;
Vlieg, E .
PHYSICAL REVIEW LETTERS, 1998, 80 (10) :2229-2232
[5]   Ordering in a fluid inert gas confined by flat surfaces [J].
Donnelly, SE ;
Birtcher, RC ;
Allen, CW ;
Morrison, I ;
Furuya, K ;
Song, MH ;
Mitsuishi, K ;
Dahmen, U .
SCIENCE, 2002, 296 (5567) :507-510
[6]  
Gai PL, 2002, MICROSC MICROANAL, V8, P21, DOI 10.1017/S1431927601010054
[7]   Simulation of shape evolution during electrodeposition of copper in the presence of additive [J].
Georgiadou, M ;
Veyret, D ;
Sani, RL ;
Alkire, RC .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (01) :C54-C58
[8]   ELECTROCHEMICAL NUCLEATION .1. GENERAL-CONSIDERATIONS [J].
GUNAWARDENA, G ;
HILLS, G ;
MONTENEGRO, I ;
SCHARIFKER, B .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1982, 138 (02) :225-239
[9]   THE INFLUENCE OF STEPS ON THE DEPOSITION OF CU ONTO AU(111) [J].
HOLZLE, MH ;
ZWING, V ;
KOLB, DM .
ELECTROCHIMICA ACTA, 1995, 40 (10) :1237-1247
[10]   COPPER DEPOSITION ONTO AU(III) IN THE PRESENCE OF THIOUREA [J].
HOLZLE, MH ;
APSEL, CW ;
WILL, T ;
KOLB, DM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (11) :3741-3749