Very-high power density AlGaN/GaN HEMTs

被引:533
作者
Wu, YF [1 ]
Kapolnek, D
Ibbetson, JP
Parikh, P
Keller, BP
Mishra, UK
机构
[1] Cree Lighting Co, Goleta, CA 93117 USA
[2] Ericsson Datacom Inc, Goleta, CA 93117 USA
[3] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
关键词
AlGaN; FET; flip-chip; GaN; HEMT; microwave power;
D O I
10.1109/16.906455
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Research work focusing on the enhancement of large-signal current-voltage (I-V) capabilities has resulted in significant performance improvement for AlGaN/GaN HEMT's. 100-150 mum wide devices grown on SIC substrates demonstrated a record power density of 9.8 W/mm at 8 GHz, which is about ten times higher than GaAs-based FETs; similar devices grown on sapphire substrates showed 6.5 W/mm, which was thermally limited, 2-mm-wide devices flip-chip mounted on to AlN substrates produced 9.2-9.8 W output power at 8 GHz with 44-47% PAE, A flip-chip amplifier IC using a 4-mm device generated 14 W at 8 GHz, representing the highest CW power obtained from GaN-based integrated circuits to date.
引用
收藏
页码:586 / 590
页数:5
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