Deformation and fracture of electrodeposited copper

被引：84

作者：

Ebrahimi, F ^{[1
]}

Zhai, Q ^{[1
]}

Kong, D ^{[1
]}

机构：

[1] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA

来源：

基金：

美国国家科学基金会;

关键词：

D O I：

10.1016/S1359-6462(98)00164-X

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

[No abstract available]

引用

页码：315 / 321

页数：7

共 17 条

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[J]. JOURNAL OF ELECTRONIC MATERIALS, 1993, 22 (06) : 631 - 638
[8] MERCHANT HD, 1995, DEFECT STRUCTURE, MORPHOLOGY AND PROPERTIES OF DEPOSITS, P301
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[10] NEEDLEMAN A, 1978, FORMABILITY ANAL MOD, P54