Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system

被引：3

作者：

Pellet, C

Lecouve, M

Fremont, H

Val, A

Esteve, D

机构：

[1] Univ Bordeaux 1, CNRS, UMR 5818, IXL, F-33405 Talence, France

[2] CNRS, LAAS, F-31077 Toulouse, France

来源：

MICROELECTRONICS AND RELIABILITY | 1998年 / 38卷 / 6-8期

关键词：

D O I：

10.1016/S0026-2714(98)00103-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Temperature cycling has been used associated to FEM simulations to evaluate thermomechanical stresses in a MCM-V packaged MEMS. The places of maximum stresses have been localized by the simulations. The results are coherent with electrical measurements done on the assembly during and after the thermal cycling. Modifications are proposed (type of material, geometry of the package) in order to improve the reliability. (C) 1998 Elsevier Science Ltd. All rights reserved.

引用

页码：1261 / 1264

页数：4