The advances and characteristics of high-power diode laser materials processing

被引：217

作者：

Li, L ^{[1
]}

机构：

[1] Univ Manchester, Inst Sci & Technol, Dept Mech Engn, Laser Proc Res Ctr, Manchester M60 1QD, Lancs, England

来源：

OPTICS AND LASERS IN ENGINEERING | 2000年 / 34卷 / 4-6期

关键词：

HPDL; high-power diode laser; materials; processing; welding; hardening; marking; rapid prototyping; machining; soldering;

D O I：

10.1016/S0143-8166(00)00066-X

中图分类号：

O43 [光学];

学科分类号：

070207 [光学]; 0803 [光学工程];

摘要：

This paper presents a review of the direct applications of high-power diode lasers for materials processing including soldering, surface modification (hardening, cladding. glazing and wetting modifications), welding, scribing, sheet metal bending, marking, engraving, paint stripping, powder sintering, synthesis, brazing and machining. The specific advantages and disadvantages of diode laser materials processing are compared with CO2, Nd:YAG and excimer lasers. An effort is made to identify the fundamental differences in their beam/material interaction characteristics and materials behaviour. Also an appraisal of the future prospects of the high-power diode lasers for materials processing is given. (C) 2001 Elsevier Science Ltd. All rights reserved.

引用

页码：231 / 253

页数：23

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