Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

被引:614
作者
Perelaer, Jolke [1 ,2 ]
Smith, Patrick J. [3 ]
Mager, Dario [4 ]
Soltman, Daniel [5 ]
Volkman, Steven K. [5 ]
Subramanian, Vivek [5 ]
Korvink, Jan G. [4 ,6 ]
Schubert, Ulrich S. [1 ,2 ]
机构
[1] Univ Jena, Lab Organ & Macromol Chem, D-07743 Jena, Germany
[2] Dutch Polymer Inst, NL-5600 AX Eindhoven, Netherlands
[3] Univ Sheffield, Dept Mech Engn, Sheffield S1 3JD, S Yorkshire, England
[4] Univ Freiburg, Lab Simulat, D-79110 Freiburg, Germany
[5] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
[6] Univ Freiburg, Freiburg Inst Adv Studies FRIAS, D-79104 Freiburg, Germany
基金
美国国家科学基金会;
关键词
SILVER TRACKS; ZNO NANOPARTICLES; INK; TEMPERATURE; FABRICATION; DEPOSITION; PARTICLES; POLYMERS; FILMS; TOOL;
D O I
10.1039/c0jm00264j
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Printed electronics represent an emerging area of research that promises large markets due to the ability to bypass traditional expensive and inflexible silicon-based electronics to fabricate a variety of devices on flexible substrates using high-throughput printing approaches. This article presents a summary of work to date in the field of printed electronics and the materials chemistry involved. In particular, the focus is upon the use of metal-and metal oxide-containing inks in the preparation of contacts and interconnects. The review discusses the challenges associated with processing these types of inks and ways to successfully obtain the desired features.
引用
收藏
页码:8446 / 8453
页数:8
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