On the thermal conductivity of adhesively bonded and sintered hollow sphere structures (HSS)

被引：13

作者：

Fiedler, T. ^{[1
,2
]}

Oechsner, A. ^{[1
,2
]}

机构：

[1] Univ Aveiro, Ctr Mech Technol & Automat, Campus Univ Santiago, P-3810193 Aveiro, Portugal

[2] Univ Aveiro, Dept Mech Engn, P-3810193 Aveiro, Portugal

来源：

DIFFUSION IN SOLIDS AND LIQUIDS: HEAT TRANSFER - MICROSTRUCTURE & PROPERTIES | 2007年 / 553卷

关键词：

thermal conductivity; hollow sphere structures; porous metals; finite elements;

D O I：

10.4028/www.scientific.net/MSF.553.39

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 [机械工程];

摘要：

This paper is on the geometrical effective thermal conductivity of hollow metal sphere structures. Two different technologies of joining, namely adhesive bonding and sintering, are considered. The spheres are arranged in the nodes of a cubic primitive lattice and connected by an adhesive layer, respectively directly joined by sintering. Furthermore, the influence of the cell wall thickness of the spheres on the thermal conductivity is investigated.

引用

页码：39 / +

页数：2

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