Study of bake mechanisms by real-time in-situ ellipsometry
被引:30
作者:
Paniez, PJ
论文数: 0引用数: 0
h-index: 0
机构:
France Telecom, CNET Grenoble, F-38243 Meylan, FranceFrance Telecom, CNET Grenoble, F-38243 Meylan, France
Paniez, PJ
[1
]
Vareille, A
论文数: 0引用数: 0
h-index: 0
机构:
France Telecom, CNET Grenoble, F-38243 Meylan, FranceFrance Telecom, CNET Grenoble, F-38243 Meylan, France
Vareille, A
[1
]
Ballet, P
论文数: 0引用数: 0
h-index: 0
机构:
France Telecom, CNET Grenoble, F-38243 Meylan, FranceFrance Telecom, CNET Grenoble, F-38243 Meylan, France
Ballet, P
[1
]
Mortini, B
论文数: 0引用数: 0
h-index: 0
机构:
France Telecom, CNET Grenoble, F-38243 Meylan, FranceFrance Telecom, CNET Grenoble, F-38243 Meylan, France
Mortini, B
[1
]
机构:
[1] France Telecom, CNET Grenoble, F-38243 Meylan, France
来源:
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XV, PTS 1 AND 2
|
1998年
/
3333卷
关键词:
resist;
polymer;
bake;
film formation;
in-situ ellipsometry;
relaxation;
compaction;
D O I:
10.1117/12.312418
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
Film formation and bake processes have been studied using in-situ ellipsometry. This new experimental set-up based on a HeNe laser mounted over a hot-plate is shown to be mainly sensitive to physical changes in the resist layer and provides real-time monitoring of the modifications induced during bake steps. Pure polymer films as well as DUV 248 nm and 193 nm CA resists are investigated.