Study of structural changes and properties for Sn-Zn9 lead-free solder alloy with addition of different alloying elements

被引：11

作者：

Kamal, M ^{[1
]}

Meikhail, MS ^{[1
]}

El-Bediwi, AB ^{[1
]}

Gouda, ES ^{[1
]}

机构：

[1] Mansoura Univ, Fac Sci, Dept Phys, Met Phys Lab, Mansoura, Egypt

来源：

RADIATION EFFECTS AND DEFECTS IN SOLIDS | 2005年 / 160卷 / 1-2期

关键词：

lead-free; solder; X-ray diffraction; double bridge; wettability;

D O I：

10.1080/10420150500085810

中图分类号：

TL [原子能技术]; O571 [原子核物理学];

学科分类号：

0827 ; 082701 ;

摘要：

The binary lead-free solder alloy Sn-Zn-9 was considered as a potential alternative to lead-tin solder alloys, when compared with other solders. In this paper, the effects of the addition of Ag, Bi, Cu and Sb on structure, melting temperature, wettability and electrical resistivity for this rapidly solidified alloy have been investigated. The results showed that a new phase Ag5Zn8 appeared, in addition to the formation of Ag3Sn and Ag4Sn for the alloy Sn-Zn-9-Ag-1, and that the intermetallic compound Cu5Zn8 appeared in the case of Sn-Zn-9-Cu-1. Also, the alloy Sn-Zn-9-Bi-1 has better properties for use as solder such as low melting point, lower electrical resistivity and lower temperature coefficient of resistivity and adequate wetting.

引用

页码：45 / 52

页数：8

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