Microstructure changes in Sn-3.5Ag solder alloy during creep

被引：34

作者：

Igoshev, VI

Kleiman, JI

Shangguan, D

Lock, C

Wong, S

Wiseman, M

机构：

[1] Integr Testing Lab Inc, N York, ON M3H 5T6, Canada

[2] Visteon Automot Syst, Dearborn, MI 48121 USA

[3] Visteon Automot Syst, Markham, ON, Canada

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1998年 / 27卷 / 12期

基金：

加拿大自然科学与工程研究理事会;

关键词：

crack formation; solder microstructure; tensile creep deformation;

D O I：

10.1007/s11664-998-0099-y

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Experimental data on behavior of the Sn-3.5Ag solder alloy microstructure during tensile creep deformation and subsequent failure is described. Depending upon applied stress, the nucleation and further development of grain boundary defects that start at an earlier stage in the deformation process was revealed. A discussion is presented on possible micromechanisms of the crack formation process.

引用

页码：1367 / 1371

页数：5

共 8 条

[1] CONSTITUTIVE RELATIONS FOR TIN-BASED SOLDER JOINTS [J].