Electrospray deposition of photoresist: A low impact method for the fabrication of multilayered films

被引：14

作者：

Rietveld, Ivo B. ^{[1
]}

Suganuma, Naotoshi ^{[2
]}

Kobayashi, Kei ^{[3
]}

Yamada, Hirofumi ^{[1
]}

Matsushige, Kazumi ^{[1
,2
]}

机构：

[1] Kyoto Univ, Dept Elect Sci & Engn, Nishikyo Ku, Kyoto 6158510, Japan

[2] Kyoto Univ, Venture Business Lab, Sakyo Ku, Kyoto 6068501, Japan

[3] Kyoto Univ, Int Innovat Ctr, Nishikyo Ku, Kyoto 6158520, Japan

来源：

MACROMOLECULAR MATERIALS AND ENGINEERING | 2008年 / 293卷 / 05期

关键词：

D O I：

10.1002/mame.200700419

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electrospray deposition has been investigated as a substitute for photoresist spin coating. The morphology of Microposit S1813 photoresist films has been studied as a function of several spray conditions including resist concentration, substrate surface, and flow rate. Film morphology is controlled by three process parameters: the surface energy determines the equilibrium conditions of resist on the substrate; the viscosity and volume flux determine the relaxation time for the depositing resist solution after impact on the substrate. Electrosprayed photoresist films have been used for photolithographic patterning and it has been demonstrated that electrospray deposition is an effective method for deposition of photoresist on top of fragile, thin films, which can be used for multilayered thin film fabrication.

引用

页码：387 / 399

页数：13

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