Compliant substrate technology: Status and prospects

被引:38
作者
Brown, AS [1 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1998年 / 16卷 / 04期
关键词
D O I
10.1116/1.590166
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Compliant substrates offer a new approach to strain management in lattice-mismatched structures. The role of the compliant substrate is to reduce the strain in a mismatched overlayer by sharing the strain via deformation of the substrate, or by nucleating and confining defects in the substrate. This can be accomplished by using a thin, "free-standing" substrate. Current efforts are primarily focused on the specification, design, and, fabrication of an "ideal" compliant substrate. Key processing issues include; the etching of the substrate and the bonding, of the substrate to a mechanical handle wafer. Dramatically reduced dislocation densities, as well as reduced relaxation rates, have been observed for the growth of mismatched overlayers on compliant substrates. (C) 1998 American Vacuum Society.
引用
收藏
页码:2308 / 2312
页数:5
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