Thermal interface materials

被引：196

作者：

Chung, DDL ^{[1
]}

机构：

[1] SUNY Buffalo, Composite Mat Res Lab, Buffalo, NY 14260 USA

来源：

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE | 2001年 / 10卷 / 01期

关键词：

conduction; heat transfer; phase change material; solder; thermal contact; thermal interface; thermal paste;

D O I：

10.1361/105994901770345358

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thermal interface materials for facilitating heat transfer by conduction across two adjacent surfaces are reviewed. They include thermal fluids and pastes, solders, phase change materials (PCMs), and resilient thermal conductors.

引用

页码：56 / 59

页数：4

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