Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module

被引：73

作者：

Chu, RC ^{[1
]}

Simons, RE ^{[1
]}

Chrysler, GM ^{[1
]}

机构：

[1] Int Business Machines, Poughkeepsie, NY 12601 USA

来源：

FIFTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM | 1999年

关键词：

D O I：

10.1109/STHERM.1999.762421

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper discusses the investigation of module cooling utilizing an enhanced thermosyphon heat loop as an alternative to direct air cooling or liquid-to-air cooling with forced convection of the liquid. Using water as the working fluid in the thermosyphon, experiments were conducted investigating the effects of fill volume, heat load, and condenser air flow rate on overall thermosyphon performance in terms of thermal resistance. Enhancement of evaporator performance using fins was also investigated and the results are reported in the paper.

引用

页码：1 / 9

页数：9

共 6 条

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[6]

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