A highly reliable self-aligned graded oxide WOx resistance memory:: Conduction mechanisms and reliability

被引:69
作者
Ho, ChiaHua [1 ]
Lai, E. K. [2 ]
Lee, M. D. [3 ]
Pan, C. L. [4 ]
Yao, Y. D. [5 ]
Hsieh, K. Y. [1 ]
Liu, Rich [1 ]
Lu, C. Y. [1 ]
机构
[1] Maxcronix Int Co Ltd, 16 Li Hsin Rd,Hsinchu Sci Pk, Hsinchu, Taiwan
[2] Natl Tsing Hua Univ, Inst Elect Engn, Hsinchu, Taiwan
[3] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
[4] Natl Chung Cheng Univ, Inst Phys, Chiayi, Taiwan
[5] Tatung Univ, Dept Mat Engn, Taipei, Taiwan
来源
2007 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS | 2007年
关键词
RRAM; WOx; self-aligned; reliability;
D O I
10.1109/VLSIT.2007.4339703
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
WOx formed by plasmas oxidation shows promising multibit/cell resistance memory characteristics [1]. The simple memory is completely self-aligned, requiring no additional masks and has a small 6F(2) cell size. In this work we introduce a graded oxide device that is highly reliable (250 degrees C baking for > 2,000 hrs). The conduction mechanism and factors affecting the memory reliability are examined extensively.
引用
收藏
页码:228 / +
页数:2
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